Aremco-Bond 556-HT-SP Screen Printable Adhesive

SKU: AR003443
$221.00
$221.00

Size 50 Gram

Units: 50 Gram
Availability: Usually ships in 3 business days
Inquire for other sizes and custom machining
Aremco-Bond 556-HT-SP is an advanced, two-part, silver-filled, screen printable, high temperature, electrically and thermally conductive adhesive used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 570°F (299°C).



Aremco-Bond 556-HT-SP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350°F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.



Typical applications for Aremco-Bond 556-HT-SP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.